Diffusion Characteristics Of Copper In Novel Metallic Films

книги
Diffusion Characteristics Of Copper In Novel Metallic Films
Год
 
Страниц
 
276
ISBN
 
9783639146264
Издатель
 
Книга по требованию

Описание:

The goal of this work was to synthesize refractory materials like TiN, Ta and alloys of TiN-TaN in the form of thin films which are used as diffusion barriers in integrated circuits to prevent diffusion of Cu into the Si substrate. The primary...

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